HSP061-2

Recommendation on PCB assembly

Doc ID 022777 Rev 1

9/12

Figure 19.

Recommended stencil window position for µQFN-4L

4.2

Solder paste

1.

Halide-free flux qualification ROL0 according to ANSI/J-STD-004.

2.

“No clean” solder paste is recommended.

3.

Offers a high tack force to resist component movement during high speed.

4.

Solder paste with fine particles: powder particle size is 20-45 µm.

4.3

Placement

1.

Manual positioning is not recommended.

2.

It is recommended to use the lead recognition capabilities of the placement system, not

the outline centering.

3.

Standard tolerance of ± 0.05 mm is recommended.

180 µm

Footprint

Footprint

T=100 µm and opening

ratio is 100%

580 µm

Stencil windo w

0.4

0.4

0.2

0.2

0.6

0.6

1.4