+V

S

V

OUT

GND

LM

35DT

+V

S

V

+V

S

V

OUT

GND

N.C.

N.C.

N.C.

N.C.

N.C.

1

2

3

4

8

7

6

5

+V

S

V

OUT

GND

t

LM35

SNIS159C – AUGUST 1999 – REVISED JULY 2013

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

CONNECTION DIAGRAMS

METAL CAN PACKAGE

SMALL-OUTLINE MOLDED PACKAGE

TO (NDV)

SOIC-8 (D)

TOP VIEW

Case is connected to negative pin (GND)

N.C. = No connection

PLASTIC PACKAGE

PLASTIC PACKAGE

TO-92 (LP)

TO-220 (NEB)

BOTTOM VIEW

Tab is connected to the negative pin

(GND).

NOTE: The LM35DT pinout is different than

the discontinued LM35DP

2

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