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MPC565MVR56 データシート(PDF) 7 Page - Freescale Semiconductor, Inc |
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MPC565MVR56 データシート(HTML) 7 Page - Freescale Semiconductor, Inc |
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7 / 16 page ![]() MOTOROLA MPC565/MPC566 Product Brief 7 Detailed Feature List 1.2.14 Queued Serial Multi-Channel Modules (QSMCM) • Two queued serial modules with one queued-SPI and two SCI each (QSMCM_A, QSMCM_B) — QSMCM_A matches full MPC555 QSMCM functionality — QSMCM_B has pins muxed with DLCMD2 module – Two pins are muxed with DLCMD2 (J1850) transmit and receive pins (B_PCS3_J1850_TX and B_RXD2_J1850_RX) – QSMCM B vs J1850 mux control provided by QPAPCS3 bit in QSMCM pin assignment register (PQSPAR) • Queued-SPI — Provides full-duplex communication port for peripheral expansion or interprocessor communication — Up to 32 preprogrammed transfers, reducing overhead — Synchronous serial interface with baud rate of up to system clock / 4 — Four programmable peripheral-select pins support up to 16 devices — Special wrap-around mode allows continuous sampling of a serial peripheral for efficient interfacing to serial analog-to-digital (A/D) converters •SCI — UART mode provides NRZ format and half- or full-duplex interface — 16 register receive buffer and 16 register transmit buffer on one SCI — Advanced error detection, and optional parity generation and detection — Word length programmable as 8 or 9 bits — Separate transmitter and receiver enable bits, and double buffering of data — Wake-up functions allow the CPU to run uninterrupted until either a true idle line is detected, or a new address byte is received 1.2.15 Electrical Specifications and Packaging • 40 MHz operation (56 MHz operation is optional for the MPC566) •-40 °C – 125°C ambient temperature, -40°C – 85°C for suffix C device, -55°C– 125°C for suffix A devices •2.6 V ± 0.1 V external bus — External bus is compatible with external memory devices operating from 2.5 V to 3.4 V. — Extended voltage range (2.7 – 3.4 V) degrades data drive timing by 1.1 ns on date writes. •2.6 ± 0.1 V internal logic • 5-V I/O (5.0 ± 0.25 V) • Available in package or bumped die • Plastic ball grid array (PBGA) packaging – 388 ball PBGA – 27 mm x 27 mm body size • 1.0 mm ball pitch Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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