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JS28F512P30TFA データシート(PDF) 10 Page - Micron Technology

部品番号 JS28F512P30TFA
部品情報  Numonyx Axcell P30-65nm Flash Memory
PDF  86 Pages
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メーカー  MICRON [Micron Technology]
ホームページ  http://www.micron.com
Logo MICRON - Micron Technology

JS28F512P30TFA データシート(HTML) 10 Page - Micron Technology

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P30-65nm
Datasheet
Sept 2012
10
Order Number: 208042-0
6
2.2
64-Ball Easy BGA Package (512-Mbit, 1-Gbit, 2-Gbit)
Lead Count
N
-
56
-
-
56
-
Lead Tip Angle
θ
0°
3°
5°
0°
3°
5°
Seating Plane Coplanarity
Y
-
-
0.100
-
-
0.004
Lead to Package Offset
Z
0.150
0.250
0.350
0.006
0.010
0.014
Notes:
1.
One dimple on package denotes Pin 1.
2.
If two dimples, then the larger dimple denotes Pin 1.
3.
Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
Figure 4: Easy BGA Mechanical Specifications (8x10x1.2 mm)
Table 2:
TSOP Package Dimensions (Sheet 2 of 2)
Product Information
Symbol
Millimeters
Inches
Min
Nom
Max
Min
Nom
Max
E
Seating
Plane
S1
S2
e
Top View - Ball side down
Bottom View - Ball Side Up
Y
A
A1
D
Ball A1
Corner
A2
Note: Drawing not to scale
A
B
C
D
E
F
G
H
87
6
54
3
2
1
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
b
Ball A1
Corner
Table 3:
Easy BGA Package Dimensions for 8x10x1.2 mm (Sheet 1 of 2)
Product Information
Symbol
Millimeters
Inches
Min
Nom
Max
Min
Nom
Max
Package Height
A
-
-
1.200
-
-
0.0472
Ball Height
A1
0.250
-
-
0.0098
-
-
Package Body Thickness
A2
-
0.780
-
-
0.0307
-
Ball (Lead) Width
b
0.330
0.430
0.530
0.0130
0.0169
0.0209
Package Body Width
D
9.900
10.000
10.100
0.3898
0.3937
0.3976



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