L4995

Package and PCB thermal data

Doc ID 13103 Rev 13

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4.2

PowerSSO-24 thermal data

Figure 35.

PowerSSO-24 PC board(1)

1.

86mm,PCB thickness=1.6mm, Cu thickness=70

μm (front and back side) Thermal vias separation 1.2 mm,

Thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 0.025 mm, Footprint dimension 4.1 mm x

6.5 mm).

Figure 36.

GAPGCFT00418