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24LC256TE/MF データシート(PDF) 13 Page - Microchip Technology |
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24LC256TE/MF データシート(HTML) 13 Page - Microchip Technology |
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13 / 34 page ![]() 2010 Microchip Technology Inc. DS21203Q-page 13 24AA256/24LC256/24FC256 9.0 PACKAGING INFORMATION 9.1 Package Marking Information XXXXXXXX T/XXXNNN YYWW 8-Lead PDIP (300 mil) Example: 8-Lead SOIC (150 mil) Example: XXXXXXXT XXXXYYWW NNN 8-Lead SOIC (208 mil) Example: 24LC256 0510017 I/SM 24AA256 I/P 017 0510 XXXXXXXX YYWWNNN T/XXXXXX 24LC256I SN 0510 017 3 e 3 e 3 e Legend: XX...X Part number or part number code T Temperature (I, E) Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) Note: For very small packages with no room for the Pb-free JEDEC designator , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e *Standard device marking consists of Microchip part number, year code, week code, and traceability code. For device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. |
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