STM32L152C6 datasheet(50/121 Pages) STMICROELECTRONICS

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Electrical characteristics

STM32L151x6/8/B, STM32L152x6/8/B

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Doc ID 17659 Rev 8

6.3

Operating conditions

6.3.1

General operating conditions

Table 13.

Thermal characteristics

Symbol

Ratings

Value

Unit

TSTG

Storage temperature range

–65 to +150

°C

Maximum junction temperature

150

°C

Table 14.

General operating conditions

Symbol

Parameter

Conditions

Min

Max

Unit

fHCLK

Internal AHB clock frequency

MHz

fPCLK1

Internal APB1 clock frequency

fPCLK2

Internal APB2 clock frequency

VDD

Standard operating voltage

BOR detector disabled

1.65

3.6

BOR detector enabled,

at power on

1.8

3.6

BOR detector disabled,

after power on

1.65

3.6

VDDA

(1)

When the ADC is used, refer to Table 54: ADC characteristics.

Analog operating voltage

(ADC and DAC not used)

Must be the same voltage

as VDD

(2)

It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV

between VDD and VDDA can be tolerated during power-up and operation.

1.65

3.6

Analog operating voltage

(ADC or DAC used)

1.8

3.6

Power dissipation at

TA = 85 °C

(3)

If TA is lower, higher PD values are allowed as long as TJ does not exceed TJ max (see Table 68: Thermal

characteristics on page 114).

BGA100 package

339

Temperature range

Maximum power dissipation

–40

°C

Low power dissipation(4)

In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJ max

(see Table 68: Thermal characteristics on page 114).

–40

105

Junction temperature range

-40 °C

≤ TA ≤ 105 °C

–40

105

°C

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