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ADuC7023BCPZ62I-R7 データシート(PDF) 91 Page - Analog Devices |
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ADuC7023BCPZ62I-R7 データシート(HTML) 91 Page - Analog Devices |
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91 / 96 page ![]() Data Sheet ADuC7023 | Page 91 of 96 TYPICAL SYSTEM CONFIGURATION A typical ADuC7023 configuration is shown in Figure 54. It summarizes some of the hardware considerations. The bottom of the LFCSP package has an exposed pad that needs to be soldered to a metal plate on the board for mechanical reasons. The metal plate of the board can be connected to ground. AVDD ADuC7023 P0.5/SDA0/PLAI[1]/COMPOUT XCLKI XCLKO RTCK TMS P0.0/nTRST/ADCBUSY/PLAI[8]/BM P0.1/PLAI[9]/TDO P0.2/PLAO[8]/TDI P0.3/PLAO[9]/TCK GNDREF DAC0 DAC1 DAC2 DAC3 P0.4/IRQ0/SCL0/PLAI[0]/CONV PULL-UPs FOR I2C PINS Figure 54. Typical System Configuration Rev. E |
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