TSL2571

LIGHT-TO-DIGITAL CONVERTER

TAOS117A − FEBRUARY 2011

20

r

r

Copyright

E 2011, TAOS Inc.

The LUMENOLOGY

r Company

www.taosinc.com

MECHANICAL DATA

PACKAGE FN

Dual Flat No-Lead

203

+ 8

6 SDA

5 INT

4 NC

SCL 2

GND 3

TOP VIEW

SIDE VIEW

BOTTOM VIEW

Lead Free

Pb

300

+ 50

650

2000

+ 100

2000

+ 100

PIN 1

PIN 1

END VIEW

650

+ 50

PIN OUT

TOP VIEW

750

+ 150

Photodiode Array Area

295

Nominal

466

+ 10

466

+ 10

(Note B)

20 Nominal

of Photodiode Array Area (Note B)

CL

140 Nominal

NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is

± 20 μm unless otherwise noted.

B. The die is centered within the package within a tolerance of

± 3 mils.

C. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.

D. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.

E. This package contains no lead (Pb).

F. This drawing is subject to change without notice.

Figure 12. Package FN — Dual Flat No-Lead Packaging Configuration