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データシートサーチシステム |
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データシートサーチシステム |
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SCML20122R2MTF データシート(PDF) 3 Page - Socay Electornics Co., Ltd. |
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SCML20122R2MTF データシート(HTML) 3 Page - Socay Electornics Co., Ltd. |
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3 / 5 page  Multilayer Chip Inductor Revision February 12, 2014 3 / 5 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. SCML Series SOCAY Electronics Co., Ltd. www.socay.com 20 For lead free solder Dimension 2012 (EIA 0805) 2016 (EIA 0806) 2520 (EIA 1008) L 2.00 ±0.20 2.00 ±0.20 2.50 ±0.20 W 1.25 ±0.20 1.60 ±0.20 2.00 ±0.20 T 0.90 ±0.10 0.90 ±0.10 0.90 ±0.10 E 0.50 ±0.30 0.50 ±0.30 0.50 ±0.30 Unit: mm Size A B C 2012 1.0~1.2 3.0~4.0 0.8~1.1 2016 1.0~1.2 3.0~4.0 1.0~1.5 2520 1.2~1.5 3.5~4.0 1.5~2.0 Unit: mm Construction & Dimensions Recommended Soldering Conditions Recommended Pad Layout L T E E W 25 150 200 217 260 Pre-heating Soldering 60~120 Second ≥30 Second 60~150 Second Time (sec.) |
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