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VDD データシート(PDF) 8 Page - Pericom Semiconductor Corporation |
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VDD データシート(HTML) 8 Page - Pericom Semiconductor Corporation |
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8 / 9 page ![]() 8 PI6C3622-1 Low Power Spread Spectrum Frequency Multiplier SSCG-GP Family PS8944A 01/30/08 PCB Layout Recommendation To optimize device performance, all components should be placed on the same side of the board and, therefore, no vias are used through other signal layers. The part should be kept away from other signal traces including ones just underneath the part or on layers adjacent to the ground plane layer used by the part. The PCB trace from the part to the ground via should be kept as short as possible. Packaging Mechanical: 8-pin, TSSOP Physical Dimensions Ordering Information Ordering Code Package Code Package Description PI6C3622-1LE L Pb-Free & Green, 8-Pin TSSOP Notes: 1. Thermal characteristics and package top marking information can be found on the company web site at www.pericom.com/packaging/ 2. E = Pb-free and Green Package 3. Adding an X suffix = Tape/Reel DESCRIPTION: 8-Pin, 173-Mil Wide, TSSOP PACKAGE CODE: L DOCUMENT CONTROL NO. PD - 1308 REVISION: E DATE: 11/15/05 Note: 1. Package Outline Exclusive of Mold Flash and Metal Burr 2. Controlling dimentions in millimeters 3. Ref: JEDEC MO-153F/AA Pericom Semiconductor Corporation 3545 N. 1st Street, San Jose, CA 95134 1-800-435-2335 • www.pericom.com |
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