17.08.2010

uvled370_10e.doc

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Precaution for Use

1. Cautions

• This device is a UV LED, which radiates intense UV light during operation.

• DO NOT look directly into the UV light or look through the optical system. To prevent

inadequate exposure of UV radiation, wearing UV protective glasses is recommended

2. Lead Forming

• When forming leads, the leads should be bent at a point at least 3 mm from the base of the

lead. DO NOT use the base of the leadframe as a fulcrum during lead forming.

• Lead forming should be done before soldering.

• DO NOT apply any bending stress to the base of the lead. The stress to the base may

damage the LED’s characteristics or it may break the LEDs.

• When mounted the LEDs onto the printed circuit board, the holes on the circuit board should

be exactly aligned with the leads of LEDs. If the LEDs are mounted with stress at the leads,

it causes deterioration of the lead and it will degrade the LEDs.

3. Soldering Conditions

• Solder the LEDs no closer than 3 mm from the base of the lead.

• Recommended soldering conditions:

Dip Soldering

Hand Soldering

Pre-Heat

120 °C Max.

Temperature

350 °C Max.

Pre-Heat Time

60 Seconds Max.

Soldering Time 3 Seconds Max.

Solder Bath Temperature 260 °C Max.

Dipping Time

5 Seconds Max.

Dipping Position

No lower than 3 mm from

the base of the epoxy bulb

Position

Not closer than 3 mm from

the base of the epoxy bulb

• Although the recommended soldering conditions are specified in the above table, dip or

hand soldering at the lowest possible temperature is desirable for the LEDs.

• A rapid-rate process is not recommended for cooling the LEDs down from the peak

temperature.

• Dip soldering and hand soldering should not be done more than one time.

• Do not apply any stress to the lead particularly when heated.

• The LEDs must not be repositioned after soldering.

• After soldering the LEDs, the lead should be protected from mechanical shock or vibration

until the LEDs return to room temperature.

• Direct soldering onto a PC board should be avoided. Mechanical stress to the resin may be

caused from warping of the PC board or from the clinching and cutting of the lead frames.

When it is absolutely necessary, the LEDs may be mounted in this fashion but the customer

will assume responsibility for any problems. Direct soldering should only be done adter

testing has confirmed that no damage, such as wire bond failure or resin deterioration, will

occur. Those LEDs should not be soldered directly to double sided PC boards because the

heat will deteriorate the epoxy resin.

• When it is necessary to clamp the LEDs to prevent soldering failure, it is important to

minimize the mechanical stress on the LEDs.

• Cut the LED leads at room temperature. Cutting the leads at high temperature may cause

the failure of the LEDs.