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1.2.2

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AS3644

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Table 3, “Electrical

Characteristics,” on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

VOUT, SW to GND

-0.3

+7.0

V

SCL, SDA, LED_OUT to GND

-0.3

VOUT+

0.3

Vmax. +7V

VOUT to SW

-0.3

V

Note: Diode between VOUT and SW

Input Pin Current without causing latchup

-100

+100

mA

Norm: EIA/JESD78

Continuous power dissipation

530

mW

1. Depending on actual PCB layout and PCB used; for peak power dissipation during flashing see document

'AS3644 Thermal Measurements'

Continuous power dissipation derating factor

7.2

mW/ºC

2

Electrostatic Discharge

ESD HBM

±2000

V

Norm: JEDEC JESD22-A114F

ESD CDM

±500

V

Norm: JEDEC JESD 22-C101C

ESD MM

±100

V

Norm: JEDEC JESD 22-A115-A level A

Temperature Ranges and Storage Conditions

Junction Temperature

+150

ºC

Internally limited (overtemperature

protection) max. 20000s

Storage Temperature Range

-55

+125

ºC

Humidity

5

85

%

Non condensing

Body Temperature during Soldering

+260

ºC

according to IPC/JEDEC J-STD-020