CDC3RL02

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SCHS371C – NOVEMBER 2009 – REVISED JANUARY 2016

7.4 Thermal Information

CDC3RL02

YFP (TSSOP)

UNIT

8 PINS

Junction-to-ambient thermal resistance

107.8

°C/W

Junction-to-case (top) thermal resistance

1.3

°C/W

Junction-to-board thermal resistance

18.1

°C/W

Junction-to-top characterization parameter

4.5

°C/W

Junction-to-board characterization parameter

18.1

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

LDO

LDO output voltage

1.71

1.8

1.89

V

External load capacitance

1

10

μF

100

mA

100

mA

60

PSR

Power supply rejection

dB

40

0.2

LDO startup time

ms

1

POWER CONSUMPTION

Standby current

0.2

1

μA

Static current consumption

Device active but not switching

0.4

1

mA

Output buffer average current

4.2

mA

Output power dissipation

44

pF

capacitance

MCLK_IN INPUT

MCLK_IN, CLK_REQ_1/2 leakage

1

μA

current

MCLK_IN capacitance

4.75

pF

MCLK_IN impedance

6

k

Ω

MCLK_IN frequency range

10

26

52

MHz

MCLK_IN LVCMOS SOURCE

1-kHz offset

–140

10-kHz offset

–149

Additive phase noise

dBc/Hz

100-kHz offset

–153

1-MHz offset

–148

Additive jitter

0.37

ps (rms)

MCLK_IN to CLK_OUT_n

11

ns

propagation delay

Output duty cycle

45%

50%

55%

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