-

-

=

q

J

A

J A

T (MAX) T

P(MAX)

4

LM3704

SNVS088F – MAY 2004 – REVISED APRIL 2016

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Copyright © 2004–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

resistance,

using:

Where the value of

package is 220°C/W.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

6

V

All other inputs

–0.3

V

Power dissipation

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±1500

V

±150

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Free-air temperature

–40

85

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

LM3704

UNIT

DGS (VSSOP)

10 PINS

Junction-to-ambient thermal resistance

163.7

°C/W

Junction-to-case (top) thermal resistance

58.3

°C/W

Junction-to-board thermal resistance

83.5

°C/W

Junction-to-top characterization parameter

6

°C/W

Junction-to-board characterization parameter

82.2

°C/W

Junction-to-case (bottom) thermal resistance

—

°C/W