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TNETX3150 データシート(PDF) 84 Page - Texas Instruments

部品番号 TNETX3150
部品情報  ThunderSWITCHE 15-PORT 10-/100-MBIT/S ETHERNETE SWITCH
PDF  113 Pages
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
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TNETX3150 データシート(HTML) 84 Page - Texas Instruments

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TNETX3150/TNETX3150A
ThunderSWITCH15-PORT 10-/100-MBIT/S ETHERNETSWITCH
SPWS027F – FEBRUARY 1997 – REVISED SEPTEMBER 1997
84
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC (see Notes 1 and 2)
–0.5 V to 4 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage range, VCC (5V) (see Notes 1 and 2)
–0.5 V to 5.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI
–0.5 V to VCC(5 V) + 0.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO
–0.5 V to VCC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal impedance, junction-to-ambient package, airflow = 0, ZθJA
11.11
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . .
Thermal impedance, junction-to-ambient package, airflow = 100 ft/min, ZθJA
9.61
°C/W
. . . . . . . . . . . . . . . . .
Thermal impedance, junction-to-case package, ZθJC
0.94
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating case temperature range, TC
0
°C to 95°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg
–65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
† Stresses beyond those listed under “absolute maximum ratings” can cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods can affect device reliability.
NOTES:
1. All voltage values are with respect to GND.
2. Turning power supplies on and off (cycling sequence) within a mixed 5-V/3.3-V system is an important consideration. The designer
must observe a few rules to avoid damaging the TNETX3150/TNETX3150A. Check with the manufacturers of all components used
in the 3.3-V to 5-V interface to ensure that no unique device characteristics exist that would lead to rules more restrictive than the
TNETX3150/TNETX3150A requires.
The optimum solution to power-supply sequencing in a mixed-voltage system is to ramp up the 3.3-V supply first. A power-on reset
component operating from this supply forces all 5-V tolerant outputs into the high-impedance state. Then, the 5-V supply is ramped
up. On power down, the 5-V rail deenergizes first, followed by the 3.3-V rail.
The second-best solution is to ramp both the 3.3-V and 5-V rails at the same time, making sure that no more than 3.6 V exists between
these two rails during the ramp up or down. If the 3.3 V is derived from the 5 V, then the 3.3 V rises as the 5 V rises so that the 5-V
rail never exceeds the 3.3-V rail by more than 3.6 V. Both the optimum and second-choice algorithms for power up prevent device
damage. If it is impractical to implement ramping, follow these rules:
When turning on the power supply, all 3.3-V and 5-V supplies should start ramping from 0 V and reach
95 percent of their end-point values within 25 ms. All bus contention between the device and external
devices is eliminated by the end of 25 ms.
Whenturning off the power supply, 3.5-V and 5-V supplies should start ramping from steady-state values
and reach 5 percent of these values within 25 ms. All bus contention between the device and external
devices is eliminated by the end of 25 ms. There is a 250-second lifetime maximum at greater than 3.6 V
between the supply rails. Holding this period to 25 ms per power-on/off cycle should not significantly
contribute to mean time between failure (MTBF) shifts during product lifetimes.



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