PESDXUSB3S_SER

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© NXP Semiconductors N.V. 2016. All rights reserved.

Product data sheet

Rev. 3 — 26 April 2016

14 of 19

NXP Semiconductors

PESDxUSB3S series

ESD protection for differential data lines

9.

Soldering

Fig 18. Soldering footprint WLCSP5 (PESD1USB3S)

WLCSP5: Solder footprint and stencil aperture

PESD1USB3S

pesd1usb3s_fr

solder resist opening (SR)

occupied area

solder land plus solder paste

solder paste deposit (SP)

solder land (SL)

Dimensions in mm

SR

P

0.25

0.325

Hx

1.00

SL

0.25

SP

0.40

15-12-11

Hy

1.40

SL = SP

SR

detail X

see

detail X

P

P

Hx

Hy

recommend stencil thickness: 0.1 mm