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MPC8245 データシート(PDF) 3 Page - Freescale Semiconductor, Inc

部品番号 MPC8245
部品情報  Part Number Specification for the MPC8245ARZUnnnX Series
PDF  20 Pages
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メーカー  FREESCALE [Freescale Semiconductor, Inc]
ホームページ  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC8245 データシート(HTML) 3 Page - Freescale Semiconductor, Inc

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MPC8245 Part Number Specification for the MPC8245ARZUnnnX Series, Rev. 2
Freescale Semiconductor
3
General Parameters
4.1.1
Absolute Maximum Ratings
The tables in this section describe the MPC8245 DC electrical characteristics. Table 1 provides the absolute
maximum ratings.
4.1.2
Recommended Operating Conditions
Table 2 provides the recommended operating conditions for the MPC8245 part numbers described herein.
Table 1. Absolute Maximum Ratings
Characteristic 1
Symbol
Range
Unit
Supply voltage—CPU core and peripheral logic
VDD
–0.3 to 2.2
V
Supply voltage—memory bus drivers
GVDD
–0.3 to 3.6
V
Supply voltage—PCI and standard I/O buffers
OVDD
–0.3 to 3.6
V
Supply voltage—PLLs
AVDD/AVDD2
–0.3 to 2.2
V
Supply voltage—PCI reference
LVDD
–0.3 to 5.4
V
Input voltage 2
Vin
–0.3 to 3.6
V
Operational die-junction temperature range
Tj
0 to 85
°C
Storage temperature range
Tstg
–55 to 150
°C
Notes:
1. Table 2 shows functional and tested operating conditions. Absolute maximum ratings are stress ratings only, and functional
operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause permanent
damage to the device.
2. PCI inputs with LVDD = 5 V ± 5% V DC may undergo corresponding stress at voltages exceeding LVDD + 0.5 V DC.
Table 2. Recommended Operating Conditions (1)
Notes:
1. Freescale tested these operating conditions and recommends them. Proper device operation outside of these conditions is
not guaranteed.
Characteristic
Symbol
Recommended
Value for
400 MHz CPU
Unit
Supply voltage
VDD
2.1 V ± 100 mV
V
CPU PLL supply voltage
AVDD
2.1 V ± 100 mV
V
PLL supply voltage—peripheral logic
AVDD2
2.1 V ± 100 mV
V
Die-junction temperature(2)
2. For information about the thermal characteristics of this part, refer to the MPC8245 Integrated Processor Hardware
Specifications. Note that the lower die-junction temperature creates a greater need to use a heat sink with this part.
Tj
0 to 85
°C



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