BCM20730 datasheet(2/62 Pages) CYPRESS

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Data Sheet

BCM20730

20730-DS108-R

5300 California Avenue • Irvine, CA 92617 • Phone: 949-926-5000 • Fax: 949-926-5203

September 9, 2013

Single-Chip Bluetooth Transceiver for Wireless

Input Devices

GE NERAL DE SCRIPTION

FEAT URES

The Broadcom® BCM20730 is a Bluetooth 3.0-

compliant, stand-alone baseband processor with an

integrated 2.4 GHz transceiver. It is ideal for wireless

input device applications including game controllers,

keyboards, 3D glasses, remote controls, gestural

input devices, and sensor devices. Built-in firmware

adheres to the Bluetooth Human Interface Device

(HID) profile and Bluetooth Device ID profile

specifications.

The BCM20730 radio has been designed to provide

low power, low cost, and robust communications for

applications operating in the globally available

2.4 GHz unlicensed ISM band. It is fully compliant

with Bluetooth Radio Specification 3.0.

The single-chip Bluetooth transceiver is a monolithic

component implemented in a standard digital CMOS

process and requires minimal external components

to make a fully compliant Bluetooth device. The

BCM20730 is available in three package options: a

32-pin, 5 mm × 5 mm QFN, a 40-pin, 6 mm × 6 mm

QFN, and a 64-pin, 7 mm × 7 mm BGA.

APPLIC ATIONS

• Wireless pointing devices: mice, trackballs,

gestural controls

•Wireless keyboards

• 3D glasses

•Remote controls

• Game controllers

• Point-of-sale (POS) input devices

•Remote sensors

• Home automation

• Personal health and fitness monitoring

• On-chip support for common keyboard and

mouse interfaces eliminates external processor

• Programmable keyscan matrix interface, up to

8 × 20 key-scanning matrix

• 3-axis quadrature signal decoder

• Shutter control for 3D glasses

• Infrared modulator

• IR learning

• Triac control

• Triggered Broadcom Fast Connect

• Supports Adaptive Frequency Hopping

• Excellent receiver sensitivity

• Bluetooth specification 3.0 compatible, including

enhanced power control (Unicast Connectionless

Data)

• Bluetooth HID profile version 1.0 compliant

• Bluetooth Device ID profile version 1.3 compliant

• Bluetooth AVRCP-CT profile version 1.3

compliant

• 10-bit auxiliary ADC with 28 analog channels

• On-chip support for serial peripheral interface

(master and slave modes)

• Broadcom Serial Communications (BSC) interface

(compatible with Philips® (now NXP) I2C slaves)

• Programmable output power control meets

Class 2 or Class 3 requirements

• Class 1 operation supported with external PA and

T/R switch

• Integrated ARM Cortex™-M3 based

microprocessor core

• On-chip power-on reset (POR)

• Support for EEPROM and serial flash interfaces

• Integrated low-dropout regulator (LDO)

• On-chip software controlled power management

unit

• Three package types are available:

– 32-pin QFN package (5 mm × 5 mm)

– 40-pin QFN package (6 mm × 6 mm)

– 64-pin BGA package (7 mm × 7 mm)

• RoHS compliant

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