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SST11CP16 データシート(PDF) 13 Page - Microchip Technology |
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SST11CP16 データシート(HTML) 13 Page - Microchip Technology |
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13 / 14 page ![]() ©2013 Silicon Storage Technology, Inc. DS70005050B 9/14 13 5.1-5.9 GHz High-Linearity Power Amplifier SST11CP16 Data Sheet Packaging Diagrams Figure 10:16-contact Extremely-thin Quad Flat No-lead (XQFN) SST Package Code: QXC Note: 1. Complies with JEDEC JEP95 MO-248, variant XEED-4 except external paddle nominal dimensions. 2. From the bottom view, the pin 1 indicator may be either a 45-degree chamfer or a half-circle notch. 3. The external paddle is electrically connected to the die back-side and to VSS. This paddle must be soldered to the PC board; it is requiresd to connect this paddle to the VSS of the unit. Connection of this paddle to any other voltage potential will result in shorts and electrical malfunction of the device. 4. Untoleranced dimensions are nominal target dimensions. 5. All linear dimensions are in millimeters (max/min). 16-xqfn-3x3-QXC-1.0 1.7 0.5 BSC See notes 2and3 Pin 1 0.30 0.18 0.075 1.7 0.15 0.05 Max 0.45 0.35 0.50 0.40 Pin 1 TOP VIEW BOTTOM VIEW SIDE VIEW 1mm 3.00 0.075 3.00 0.075 |
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