MCP6V92 datasheet(39/48 Pages) MICROCHIP

39 / 48 page

 2015-2016 Microchip Technology Inc.

DS20005434B-page 39

MCP6V91/1U/2/4

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Optional Center Pad Length

Contact Pitch

1.80

1.65

MILLIMETERS

0.50 BSC

MIN

MAX

Contact Pad Length (X8)

Contact Pad Width (X8)

0.85

0.25

Microchip Technology Drawing No. C04-129-MNY Rev. A

NOM

8-Lead Plastic Dual Flat, No Lead Package (MNY) – 2x3x0.75mm Body [TDFN]

Contact Pad Spacing

2.90

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

ØV

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