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LMX9820 データシート(PDF) 2 Page - National Semiconductor (TI) |
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LMX9820 データシート(HTML) 2 Page - National Semiconductor (TI) |
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2 / 40 page ![]() www.national.com 2 3.0 Features ■ Bluetooth version 1.1 qualified ■ Implemented in CMOS technology on LTCC substrate. ■ Temperature Range: -40°C to +85°C 3.1 DIGITAL HARDWARE ■ Baseband and Link Management processors ■ CompactRISC Core ■ Integrated Memory: –Flash –RAM ■ UART Command/Data Port: – Support for up to 921.6k baud rate ■ Auxiliary Host Interface Ports: – Link Status – Transceiver Status (Tx or Rx) – Operating Environment Control: – Default Bluetooth mode – In System Programming (ISP) mode ■ Advanced Power Management (APM) features 3.2 FIRMWARE ■ Complete Bluetooth Stack including: – Baseband and Link Manager – L2CAP, RFCOMM, SDP –Profiles: –GAP –SDAP – SPP ■ Additional Profile support on Host for: – Dial Up Networking (DUN) – Facsimile Profile (FAX) – File Transfer Protocol (FTP) – Object Push Profile (OPP) – Synchronization Profile (SYNC) ■ On-chip application including: – Command Interface: – Link setup and configuration (also Multipoint) – Configuration of the module – In system programming – Service database modifications – Default connections – UART Transparent mode – Different Operation modes: – Automatic mode – Command mode 3.3 DIGITAL SMART RADIO ■ Accepts external clock or crystal input: –12 MHz – 20 ppm cumulative clock error required for Bluetooth ■ Synthesizer: – Integrated VCO and loop filter – Provides all clocking for radio and baseband func- tions ■ Antenna Port (50 Ohms nominal impedance): – Embedded front-end filter for enhanced out of band performance ■ Integrated transmit/receive switch (full duplex operation via antenna port) ■ Embedded Balun ■ Better than -77 dBm input sensitivity ■ 0 dBm typical output power 3.4 PHYSICAL ■ Compact size - 10.1mm x 14.0mm x 1.9mm ■ Complete system interface provided in Land Grid Array on underside for surface mount assembly ■ Metal shield included Figure 1. Physical Illustration |
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