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WM8753LEB/RV データシート(PDF) 86 Page - Wolfson Microelectronics plc |
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WM8753LEB/RV データシート(HTML) 86 Page - Wolfson Microelectronics plc |
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86 / 87 page  Advanced Information WM8753L w AI Rev 3.1 June 2004 86 PACKAGE DIAGRAM - 52-PIN BGA DM034.A B: 52 BALL BGA PLASTIC PACKAGE 5 X 5 X 0.9 mm BODY, 0.50 mm BALL PITCH A1 CORNER TOP VIEW E Z 0.10 2 X D 5 4 DETAIL 2 DETAIL 2 A A2 2 NOTES: 1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’. 3. DIMENSION ‘b’ IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM -Z-. 4. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE. 5. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY. 6. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH. 7. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE. A1 0.27 0.21 0.15 b D D1 E E1 e 0.35 0.25 5.00 BSC 4.00 BSC 0.50 BSC 5.00 BSC 4.00 BSC 0.30 Dimensions (mm) Symbols MIN NOM MAX NOTE A 0.95 1.11 1.27 A2 0.80 0.90 1.00 3 Y Z ccc X Z 0.10 2 X A1 Z aaa Z bbb Z 1 DETAIL 1 SOLDER BALL b Z ddd 0.10 aaa bbb ccc 0.80 0.15 Tolerances of Form and Position ddd 0.05 6 E1 A D1 DETAIL 1 D C B J H G F E e e BOTTOM VIEW 1 98 7 6 54 32 6 |
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