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Data Sheet

AD4001

Rev. 0 | Page 7 of 33

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

Analog Inputs

IN+, IN− to GND1

−0.3 V to VREF + 0.4 V

or ±50 mA

Supply Voltage

REF, VIO to GND

−0.3 V to +6.0 V

VDD to GND

−0.3 V to +2.1 V

VDD to VIO

−6 V to +2.4 V

Digital Inputs to GND

−0.3 V to VIO + 0.3 V

Digital Outputs to GND

−0.3 V to VIO + 0.3 V

Storage Temperature Range

−65°C to +150°C

Junction Temperature

150°C

Lead Temperature Soldering

260°C reflow as per

JEDEC J-STD-020

ESD Ratings

Human Body Model

4 kV

Machine Model

200 V

Field-Induced Charged Device Model

1.25 kV

See the Analog Inputs section for an explanation of IN+ and IN−.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

Note that the clamp cannot sustain the overvoltage condition

for an indefinite time.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Table 6. Thermal Resistance

Package Type

θJA

θJC

Unit

RM-101

147

°C/W

CP-10-91

114

°C/W

Test Condition 1: thermal impedance simulated values are based upon use

of 2S2P JEDEC PCB. See the Ordering Guide.

ESD CAUTION

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