FT260Q-R datasheet(55/61 Pages) FTDI

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FT260 HID-CLASS USB TO UART/I2C BRIDGE IC

Version 1.1

Document No.: FT_001272 Clearance No.: FTDI#484

10.5

Solder Reflow Profile

The FT260 is supplied in a Pb free WQFN-28 and TSSOP-28 package. The recommended solder reflow

profile is shown in Figure 10.3.

Figure 10.5 FT260 Solder Reflow Profile

The recommended values for the solder reflow profile are detailed in Table 10.1. Values are shown for

both a completely Pb free solder process (i.e. the FT260 is used with Pb free solder), and for a non-Pb

free solder process (i.e. the FT260 is used with non-Pb free solder).

Profile Feature

Pb Free Solder Process

Non-Pb Free Solder Process

Average Ramp Up Rate (Ts to Tp)

3°C / second Max.

3°C / Second Max.

Preheat

- Temperature Min (Ts Min.)

- Temperature Max (Ts Max.)

- Time (ts Min to ts Max)

150°C

200°C

60 to 120 seconds

100°C

150°C

60 to 120 seconds

Time Maintained Above Critical Temperature

TL:

- Temperature (TL)

- Time (tL)

217°C

60 to 150 seconds

183°C

60 to 150 seconds

Peak Temperature (Tp)

260°C

240°C

Time within 5°C of actual Peak Temperature

(tp)

20 to 40 seconds

Ramp Down Rate

6°C / second Max.

Time for T= 25°C to Peak Temperature, Tp

8 minutes Max.

6 minutes Max.

Table 10.1 Reflow Profile Parameter Values

Critical Zone: when

T is in the range

T to T

Time, t (seconds)

T = 25º C to T

Preheat

Ramp Up

Ramp

Down

T Max

T Min

FT260Q-R データシート(PDF) 55 Page - Future Technology Devices International Ltd.

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