Characteristics

STPS3L60U-Y

4/7

DocID024414 Rev 1

Figure 11. Thermal resistance junction to ambient versus copper surface under each lead

Figure 7. Reverse leakage current versus

reverse voltage applied

(typical values)

Figure 8. Junction capacitance versus reverse

voltage applied

(typical values)

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

0

5

10

15

20

25

30

35

40

45

50

55

60

Tj=125°C

Tj=25°C

Tj=100°C

V (V)

R

I (mA)

R

10

100

1000

1

10

100

F=1MHz

Vosc=30mV

Tj=25°C

V (V)

R

C(pF)

Figure 9. Forward voltage drop versus forward

current (high level)

Figure 10. Forward voltage drop versus forward

current (low level)

0

5

10

15

20

25

30

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

2.4

Tj=25°C

(Maximum values)

Tj=100°C

(Maximum values)

Tj=100°C

(Maximum values)

Tj=100°C

(Typical values)

Tj=100°C

(Typical values)

I

(A)

FM

V

(V)

FM

0

1

2

3

4

5

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

Tj=25°C

(Maximum values)

Tj=100°C

(Maximum values)

Tj=100°C

(Maximum values)

Tj=100°C

(Typical values)

Tj=100°C

(Typical values)

I

(A)

FM

V

(V)

FM

0

20

40

60

80

100

120

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SMB

S(Cu)(cm²)

R

(°C/W)

th(j-a)

copper thickness = 35 µm

Expoxy printed circuit FR4,