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STM8S003F3 データシート(PDF) 92 Page - STMicroelectronics |
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STM8S003F3 データシート(HTML) 92 Page - STMicroelectronics |
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92 / 104 page  Package information STM8S003F3 STM8S003K3 92/104 DocID018576 Rev 9 Figure 48. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch, package footprint 1. Dimensions are expressed in millimeters. k 0° - 8° 0° - 8° aaa - - 0.100 - - 0.0039 1. Values in inches are converted from mm and rounded to four decimal digits. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per side. 3. Dimension "E1" does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side. Table 53. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch, package mechanical data Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. |
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