Product Identification Code

Code

Pins

Hex

Data

A0

A1

DQ7

DQ6

DQ5

DQ4

DQ3

DQ2

DQ1

DQ0

Manufacturer

0100011100

1C

Device Type

1100000001

01

Continuation

0001111111

7F

1001111111

7F

HT27C010

Rev. 1.10

6

November 21, 2002

System considerations

During the switch between active and standby condi-

tions, transient current peaks are produced on the rising

and falling edges of Chip Enable. The magnitude of

these transient current peaks is dependent on the out-

put capacitance loading of the device. At a minimum, a

0.1

mF ceramic capacitor (high frequency, low inherent

inductance) should be used on each device between

VCC and VPP to minimize transient effects. In addition,

to overcome the voltage drop caused by the inductive

effects of the printed circuit board traces on EPROM ar-

rays, a 4.7

mF bulk electrolytic capacitor should be used

between VCC and VPP for each eight devices. The lo-

cation of the capacitor should be close to where the

power supply is connected to the array.

Operation mode truth table

All the operation modes are shown in the table following.

Mode

CE

OE

PGM

A0

A1

A9

VPP

Output

Read

X (2)

X

X

X

Dout

Output Disable

XXXX

High Z

Standby (TTL)

XXXXX

High Z

Standby (CMOS)

XXXXX

High Z

Program

XXX

Program Verify

XXX

Product Inhibit

XXXXX

High Z

Manufacturer Code (3)

1C

Device Type Code (3)

01

Note:

± 0.5V

O E

A d d r e s s

A d d r e s s V a l i d

H I G H Z

O u t p u t V a l i d

O u t p u t

C E

Figure 1. A.C. waveforms for read operation