MPXM2010GS datasheet(97/670 Pages) MOTOROLA

データシートサーチシステム

MPXM2010GS データシート(PDF) 97 Page - Motorola, Inc

97 / 670 page

MMA3201D

2–61

Motorola Sensor Device Data

www.motorola.com/semiconductors

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must

be the correct size to ensure proper solder connection inter-

face between the board and the package. With the correct

footprint, the packages will self–align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and short-

ing between solder pads.

Figure 6. Footprint SOIC–20 (Case 475A–01)

0.380 in.

9.65 mm

0.050 in.

1.27 mm

0.024 in.

0.610 mm

0.080 in.

2.03 mm

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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