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MP8764 データシート(PDF) 2 Page - Monolithic Power Systems |
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MP8764 データシート(HTML) 2 Page - Monolithic Power Systems |
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2 / 23 page ![]() MP8764 ― 12A, 18V, SYNCHRONOUS STEP-DOWN CONVERTER WITH LATCH-OFF OCP MP8764 Rev. 1.2 www.MonolithicPower.com 2 6/21/2016 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2016 MPS. All Rights Reserved. ORDERING INFORMATION Part Number* Package Top Marking MP8764GLE 16-Pin QFN (3X4mm) MP8764 E * For Tape & Reel, add suffix –Z (e.g. MP8764GLE–Z); PACKAGE REFERENCE TOP VIEW PG ND 4 IN 2 B ST 12 13 14 15 16 8 7 6 VCC PG A G ND S S FB FREQ E N PG ND SW 3 1 SW 5 PG ND IN 11 10 9 PG ND 16-Pin QFN (3x4mm) ABSOLUTE MAXIMUM RATINGS (1) Supply Voltage VIN .......................................21V VSW .......................................-0.3V to VIN + 0.3V VSW (30ns) ..................................-3V to VIN + 3V VBST .....................................................VSW + 6V Enable Current IEN (2)................................ 2.5mA All Other Pins................................ –0.3V to +6V Continuous Power Dissipation (TA=+25°) (3) QFN3X4……………………….…..…………2.7W Junction Temperature .............................. 150°C Lead Temperature ................................... 260°C Storage Temperature............... -65°C to +150°C Recommended Operating Conditions (4) Supply Voltage VIN .......................... 4.5V to 18V Output Voltage VOUT.................... 0.611V to 13V IEN ................................................ 0mA to 1mA Operating Junction Temp. (TJ). -40°C to +125°C Thermal Resistance (5) θJA θJC QFN (3x4mm) ........................ 46 ....... 9.... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) Refer to the section “Configuring the EN Control”. 3) The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD(MAX)=(TJ(MAX)- TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 4) The device is not guaranteed to function outside of its operating conditions. 5) Measured on JESD51-7, 4-layer PCB. |
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