ADM1266ACPZ-R7 datasheet(10/62 Pages) AD

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ADM1266

Data Sheet

Rev. A | Page 10 of 62

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

VHx, PDIOx to GND

21 V

VPx, AVDD_CAP to GND

5.5 V

DACx to GND

3.6 V

REFOUT to GND

3.6 V

ADDR to GND

3.6 V

REFGND, EPAD to GND

−0.3 V to +0.3 V

All Other Pins to GND

3.6 V

Maximum Junction Temperature (TJ max)

150°C

Storage Temperature Range1

−65°C to +125°C

ESD Rating, All Pins

Charged Device Model

750 V

Human Body Model

2000 V

1 See the Acceleration Factor section.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal resistance

measured in a one cubic foot sealed enclosure. The thermal

resistance values specified in Table 5 are calculated based on

JEDEC specs and must be used in compliance with JESD51-12.

Table 5. Thermal Resistance1

Package Type

θJA2

θJC_BOTTOM3, 4

ΨJT

ΨJB

Unit

CP-64-15

24.2

0.6

0.1

3.6

˚C/W

1 The values in Table 5 are calculated based on standard JEDEC test conditions,

unless otherwise specified

2 θJA is simulated using a 2S2P PCB with 49 standard JEDEC vias.

3 For the θJC_BOTTOM test, 100 µm TIM is used. TIM is assumed to have 3.6 W/mK.

4 θJC_BOTTOM is simulated using a 1S0P PCB with 49 standard JEDEC vias.

ESD CAUTION

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