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GD5F1GQ4REFJS データシート(PDF) 54 Page - GigaDevice Semiconductor (Beijing) Inc.

部品番号 GD5F1GQ4REFJS
部品情報  SPI(x1/x2/x4) NAND Flash
PDF  60 Pages
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メーカー  GIGADEVICE [GigaDevice Semiconductor (Beijing) Inc.]
ホームページ  http://www.gigadevice.com/
Logo GIGADEVICE - GigaDevice Semiconductor (Beijing) Inc.

GD5F1GQ4REFJS データシート(HTML) 54 Page - GigaDevice Semiconductor (Beijing) Inc.

Back Button GD5F1GQ4REFJS Datasheet HTML 50Page - GigaDevice Semiconductor (Beijing) Inc. GD5F1GQ4REFJS Datasheet HTML 51Page - GigaDevice Semiconductor (Beijing) Inc. GD5F1GQ4REFJS Datasheet HTML 52Page - GigaDevice Semiconductor (Beijing) Inc. GD5F1GQ4REFJS Datasheet HTML 53Page - GigaDevice Semiconductor (Beijing) Inc. GD5F1GQ4REFJS Datasheet HTML 54Page - GigaDevice Semiconductor (Beijing) Inc. GD5F1GQ4REFJS Datasheet HTML 55Page - GigaDevice Semiconductor (Beijing) Inc. GD5F1GQ4REFJS Datasheet HTML 56Page - GigaDevice Semiconductor (Beijing) Inc. GD5F1GQ4REFJS Datasheet HTML 57Page - GigaDevice Semiconductor (Beijing) Inc. GD5F1GQ4REFJS Datasheet HTML 58Page - GigaDevice Semiconductor (Beijing) Inc. Next Button
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SPI(x1/x2/x4) NAND Flash
1G
54
21 PACKAGE INFORMATION
Figure21-1. WSON8 (6*8mm)
D
E
Top View
D2
E2
L
b
e
Bottom View
c
A1
A
Side View
Dimensions
Symbol
A
A1
c
b
D
D2
E
E2
e
L
Unit
mm
Min
0.70
0.00
0.180
0.35
7.90
3.30
5.90
4.20
1.27
0.45
Nom
0.75
0.02
0.203
0.40
8.00
3.40
6.00
4.30
0.50
Max
0.80
0.05
0.250
0.45
8.10
3.50
6.05
4.40
0.55
Inch
Min
0.028
0
0.007
0.014
0.311
0.130
0.232
0.165
0.05
0.018
Nom
0.030
0.001
0.008
0.016
0.315
0.134
0.236
0.169
0.020
Max
0.032
0.002
0.010
0.018
0.319
0.138
0.238
0.173
0.022
Note:
1. Both the package length and width do not include the mold flash.
2. The exposed metal pad area on the bottom of the package is floating.
3. Coplanarity ≤0.08mm. Package edge tolerance≤0.10mm.
4. The lead shape may be of little difference according to different package lead frames. These lead
shapes are compatible with each other.



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