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GD25LE16CSIG データシート(PDF) 29 Page - GigaDevice Semiconductor (Beijing) Inc.

部品番号 GD25LE16CSIG
部品情報  1.8V Uniform Sector Dual and Quad Serial Flash
PDF  67 Pages
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GD25LE16CSIG データシート(HTML) 29 Page - GigaDevice Semiconductor (Beijing) Inc.

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1.8V Uniform Sector
Dual and Quad Serial Flash
GD25LE16C
29
7.21 Release from Deep Power-Down and Read Device ID (RDI) (ABH)
The Release from Power-Down and Read Device ID command is a multi-purpose command. It can be used to release the
device from the Power-Down state or obtain the devices electronic identification (ID) number.
To release the device from the Power-Down state, the command is issued by driving the CS# pin low, shifting the
instruction code
“ABH” and driving CS# high as shown in Figure22. Release from Power-Down will take the time duration
of tRES1 (See AC Characteristics) before the device will resume normal operation and other c omma nd are accepted. The
CS# pin must remain high during the tRES1 time duration.
When used only to obtain the Device ID while not in the Power-Down state, the command is initiated by driving the CS#
pin low and shifting the instruction code
“ABH” followed by 3-dummy byte. The Device ID bits are then shifted out on the
falling edge of SCLK with most significant bit (MSB) first as shown in Figure23. The Device ID value is listed in
Manufacturer and Device Identification table. The Device ID can be read continuously. The command is completed by
driving CS# high.
When used to release the device from the Power-Down state and obtain the Device ID, the command is the same as
previously described, and shown in Figure23, except that after CS# is driven high it must remain high for a time duration
of tRES2 (See AC Characteristics). After this time duration the device will resume normal operation and other command will
be accepted. If the Release from Power-Down / Device ID command is issued while an Erase, Program or Write cycle is
in process (when WIP equal 1) the command is ignored and will not have any effects on the current cycle.
Figure22. Release Power-Down Sequence Diagram
Figure23. Release Power-Down/Read Device ID Sequence Diagram
7.22 Read Manufacture ID/ Device ID (REMS) (90H)
The Read Manufacturer/Device ID command is an alternative to the Release from Power-Down / Device ID command that
provides both the JEDEC assigned Manufacturer ID and the specific Device ID.
The command is initiated by driving the CS# pin low and shifting the command
code “90H” followed by a 24-bit address
(A23-A0) of 000000H. After which, the Manufacturer ID and the Device ID are shifted out on the falling edge of SCLK with
most significant bit (MSB) first as shown in Figure24. If the 24-bit address is initially set to 000001H, the Device ID will be
read first.
Command
0
1
2
3
4
5
6
7
ABH
CS#
SCLK
SI
RES1
Stand-by mode
Deep Power-down mode
t
Command
0
1
2
3
4
5
6
7
ABH
CS#
SCLK
SI
8
9
29 30 31
MSB
2
1
0
3 Dummy Bytes
23 22
32 33 34 35 36 37 38
7
6
5
4
3
2
1
0
SO
MSB
t RES2
Stand-by Mode
Deep Power-down Mode
High-Z
Device ID



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