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GD25LE16CSIG データシート(PDF) 64 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD25LE16CSIG データシート(HTML) 64 Page - GigaDevice Semiconductor (Beijing) Inc. |
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64 / 67 page ![]() 1.8V Uniform Sector Dual and Quad Serial Flash GD25LE16C 64 10.9 Package LGA8 3*2mm D E D1 E1 b e L L1 A c Soldermask LAND PAD A1 1 4 8 5 PIN 1# Dimensions Symbol A A1 c b D D1 E E1 e L L1 Unit mm Min 0.34 0.00 0.14 0.20 2.90 0.15 1.90 1.55 0.50 0.28 0.03 Nom 0.42 0.02 0.17 0.25 3.00 0.20 2.00 1.60 0.35 0.10 Max 0.50 0.05 0.20 0.30 3.10 0.25 2.10 1.65 0.43 0.18 Note: 1. Both the package length and width do not include the mold flash. 2. The exposed metal pad area on the bottom of the package is floating. 3. Coplanarity ≤0.08mm. Package edge tolerance≤0.10mm. 4. The lead shape may be of little difference according to different package factories. These lead shapes are compatible with each other. |
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