34

Data Sheet S13918EJ3V0DS

5. RECOMMENDED SOLDERING CONDITIONS

The

µPD72012 should be soldered and mounted under the following recommended conditions. For the details of

the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology

Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact your NEC sales

representative.

Surface mount type soldering conditions

µµµµPD72012GB-XXX-3B4: 44-pin plastic QFP (10 ×××× 10)

Soldering Method

Soldering Conditions

Recommended

Condition Code

Infrared reflow

Peak package temperature: 235

°C, Time: 30 sec. max. (210°C min.), Count: three

times or less

IR35-00-3

VPS

Peak package temperature: 215

°C, Time: 40 sec. max. (200°C min.), Count: three

times or less

VP15-00-3

Wave soldering

Solder bath temperature: 260

°C max., Time: 10 sec. max., Count: once,

Preheating temperature: 120

°C max. (package surface temperature)

WS60-00-1

Pin partial heating

Pin temperature: 300

°C max., Time: 3 sec. max. (per device side)

–

Caution

Avoid using different soldering methods together. (However, the pin partial heating method is

excluded.)

Through-hole type soldering conditions

µµµµPD72012CU-XXX: 42-pin plastic SDIP (15.24 mm (600))

Soldering Method

Soldering Conditions

Wave soldering (pins

only)

Solder bath temperature: 260

°C max., Time: 10 sec. max.

Pin partial heating

Pin temperature: 300

°C max., Time: 3 sec. max. (per pin)

Caution

Apply wave soldering only to the pins, and exercise care that solder does not directly contact

the package.