FBSGAM02PR50 datasheet(21/33 Pages) EPC-CO

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FBS-GAM02-P-R50 Datasheet

Pin Descriptions (continued)

BSTP (Pin 16)

The BSTP pin is the open drain output for the input shoot-through protection for low-side power

driver. The state of this pin is the logical inverse of the BIN logic input pin. If input shoot-through

protection is desired in the half-bridge configuration where both power drivers (low and high) must

not be turned on simultaneously if the BIN and TIN logic inputs are simultaneously at logic “1”, then

BSTP (pin 16) should be externally connected to BCON (pin 15). If no shoot-through protection is

desired, then pin 16 should be left OPEN (no connection).

TSTP (Pin 17)

The TSTP pin is the open drain output for the input shoot-through protection for high-side power

driver. The state of this pin is the logical inverse of the TIN logic input pin. If input shoot-through

protection is desired in the half-bridge configuration where both power drivers (low and high) must

not be turned on simultaneously if the BIN and TIN logic inputs are simultaneously at logic “1”, then

TSTP (pin 17) should be externally connected to TCON (pin 18). If no shoot-through protection is

desired, then pin 17 should be left OPEN (no connection).

TCON (Pin 18)

The TCON pin is the logic input for the input shoot-through protection for high-side power driver.

The state of this pin follows the state of the BIN logic input pin. If input shoot-through protection

is desired in the half-bridge configuration where both power drivers (low and high) must not be

turned on simultaneously if the BIN and TIN logic inputs are simultaneously at logic “1”, then TCON

(pin 18) should be externally connected to TSTP (pin 17). If no shoot-through protection is desired,

then pin 18 should be left OPEN (no connection).

Top (X-Ray) View

18 Pin Molded SMT Package

with Pillar Pins

Bottom (Pad) View

FBSGAM02PR50 データシート(PDF) 21 Page - Efficient Power Conversion Corporation.