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FBS-GAM02-P-R50 Datasheet

EPC Space Part Number Information

50 = 50 V

FBS - GAM02 - P - R50

P = Molded Plastic SMT Package

C = Ceramic SMT Package

EPC Space Semiconductor “

GaN Adaptor Module”

C = Development Module

R = Radiation Hardened*

The Soak Zone – normally occupies 33-50% of the total heated tunnel length exposes the PCB to a relatively steady temperature

that will allow the components of different mass to be uniform in temperature. The soak zone also allows the flux to concentrate and

the volatiles to escape from the paste.

The Reflow Zone – or spike zone is to elevate the temperature of the PCB assembly from the activation temperature to the

recommended peak temperature. The activation temperature is always somewhat below the melting point of the alloy, while the peak

temperature is always above the melting point.

Reflow – Best results achieved when reflowed in a forced air convection oven with a minimum of 8 zones (top & bottom), however

reflow is possible with a four (4)-zone oven (top & bottom) with the recommended profile for a forced air convection reflow process.

The melting temperature of the solder, the heat resistance of the components, and the characteristics of the PCB (i.e. density,

thickness, etc.) determine the actual reflow profile.

Note* FBS-GAM02-P-R50 solder attachment has a maximum peak dwell

temperature of 230°C limit, exceeding the maximum peak temperature can cause damage to the unit.

Reflow Process Disclaimer

The profile is as stated “Example”. The-end user can optimize reflow profiling based against the actual solder paste and reflow oven

used. EPC Space assumes no liability in conjunction with the use of this profile information.

*FBS-GAM02-P-R50 (Utilizes High Lead Content Die) and FBS-GAM02-P-C50 (Utilizes High Lead Content Die)