6.3 Thermal Information

THERMAL METRIC(1)

TMUX7462F

UNIT

PW (TSSOP)

RRP (WQFN)

16 PINS

16 PINS

Junction-to-ambient thermal resistance

TBD

42.8

°C/W

Junction-to-case (top) thermal resistance

TBD

28.5

°C/W

Junction-to-board thermal resistance

TBD

17.9

°C/W

Junction-to-top characterization parameter

TBD

0.3

°C/W

Junction-to-board characterization parameter

TBD

17.9

°C/W

Junction-to-case (bottom) thermal resistance

TBD

4.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX UNIT

Power supply voltage differential

8

44

V

Positive power supply voltage

5

44

Positve fault clamping voltage

3

Negative fault clamping voltage

0

Source pin (Sx) voltage (non-fault condition)

V

Source pin (Sx) voltage to GND (fault condition)

–60

60

–85

85

Drain pin (Dx) voltage

Logic input pin (DR) voltage

GND

44

V

Logic output pin (FF) voltage

GND

5.5

Ambient temperature

–40

125

°C

Continuous current through switch, WQFN package

150

mA

100

60

(1)

(2)

(3)

Logic output pin (FF) is an open drain output and should be pulled up to a voltage within the max ratings

6.5 Electrical Characteristics (Global)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ANALOG SWITCH

Threshold voltage for fault detector

25°C

0.7

V

LOGIC INPUT/ OUTPUT

High-level input voltage

DR pin

–40°C to +125°C

1.3

V

Low-level input voltage

DR pin

–40°C to +125°C

0.8

V

High-level input current

–40°C to +125°C

0.4

3

µA

Low-level input current

–40°C to +125°C

–1

–0.65

µA

Low-level output voltage

–40°C to +125°C

0.35

V

www.ti.com

TMUX7462F

SCDS394A – MARCH 2021 – REVISED OCTOBER 2021

Copyright © 2021 Texas Instruments Incorporated

Submit Document Feedback

5

Product Folder Links: TMUX7462F