LTM4650 datasheet(4/138 Pages) AD

4 / 138 page

LTM4664A

Rev. 0

For more information www.analog.com

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

4:1 Divider

VINS1, SW1, SW2, INSNSS1+, INSNSS1–,

FAULTS1, FAULTS2.............................................–0.3V to 60V

VINS2, VINS2F, INSNSS2+, INSNSS2–, PGOODS1,

PGOODS2, EXTVCCS1, EXTVCCS2, SW3, SW4,

OVP_SET, VOUT2_SET, OVP_TRIP, VOUT1 .......–0.3V to 40V

VOUT2........................................................... 0.3V to 20V

INTVCCS1, INTVCCS2...............OUTPUT ONLY, RATED 6V

RUNS1, RUNS2............................................ –0.3V to 6V

UVS1, UVS2, HYS_PRGMS1, HYS_PRGMS2,

TIMERS1, TIMERS2, FREQS1,

FREQS2.....................–0.3V to INTVCCS1, –0.3 to INTVCCS2

DUAL 25A/30A PSM SECTION

VINS3_Cn, IN+, IN– ...................................... –0.3V to 18V

(VINS3_Cn – IN+), (IN+ – IN–)...................... –0.3V to 0.3V

SWC0, SWC1.............. –1V to 18V, –5V to 18V Transient

(Note 1)

BGA PACKAGE

240-PIN (16mm × 16mm × 7.72mm)

TJMAX = 125°C, θJCTOP = 5.47 C/W, θJCBOTTOM = 2.15 C/W, θJA = 5.3 C/W

θJC VALUES ARE DETERMINED BY SIMULATION PER JESD51 CONDITIONS.

θJA VALUE IS OBTAINED FROM MEASUREMENTS WITH DEMO BOARD. WEIGHT = 7.26 GRAMS.

REFER TO PAGE 78 FOR LAB MEASUREMENT AND DERATING INFORMATION.

NOTE: NOT RECOMMENDED FOR BACK-SIDE REFLOW SOLDERING. SEE WEBSITE FOR MORE INFORMATION.

VINS2

TSNS_C0b

GL_C0

PHFLT_C0

TSNSC_1a

COMP_0b

COMP_0a

PGOOD_C0

GND

VOUTC0_CFG

VOUTC1_CFG

VDD25

VDD33

COMP_1a

VOSNS–_C1

VOSNS+_C1

VOUTC1

VOUTC0

VOUT1

SW2

SW1

SW4

SW3

INSNSS2–

VOUT2

SWC1

SWC0

SDA SCL TSNSC_0a

RUN_C1

FAULT_C1

FAULT_C0

ASEL

ALERT

VINS1

VTRIMC1_CFG

VTRIMC0_CFG

GL_C1

PHFLT_C1

RUN_C0

INSNSS1

–

INSNSS1

FSWPH_CFG

VINS3_C1

VINS3_C0

TOP VIEW

TSNS_C1b

INTVCC EXTVCC

INTVCCS1

PGOODS1

EXTVCCS1

FAULTS1

VINS2F

INSNSS2+

HYS_PRGMS2

OVP_SET

UVS1

FREQS1

RUNS1 TIMERS1

HYS_PRGMS1

OVP_TRIP

TIMERS2

RUNS2

EXTVCCS2

VOUT2_SET

INTVCCS2

PGOOD_C1

FREQS2

UVS2

PGOODS2

FAULTS2

PWM_C1

SHARE_CLK

COMP_1b SGN_DC0_C1

SGND_C0_C1

IN–

IN+

SYNC

VOSNS–_C0

VOSNS+_C0

PWM_C0

EXTVCC........................................................ –0.3V to 6V

VOUTCn ...................................................... –0.3V to 3.6V

VOSNS+_Cn................................................... –0.3V to 6V

VOSNS–_Cn................................................ –0.3V to 0.3V

RUN_Cn, SDA, SCL, ALERT....................... –0.3V to 5.5V

FSWPH_CFG, VOUTCn_CFG, VTRIMCn_CFG, ASEL,

COMP_1a, COMP_1b, COMP_0a, COMP_0b........–0.3V to 2.75V

FAULT_Cn, SYNC, SHARE_CLK, WP, PGOOD_Cn,

PWM_Cn, PHFLT_Cn ................................. –0.3V to 3.6V

TSNS_Cna, ............................................... –0.3V to 2.2V

TSNS_Cnb .................................... –0.3V to 0.8V, < 5mA

OVP-SET IMAX Sink.................................... ………. 5mA

INTVCC VDD33, VDD25 and GL_Cn are Outputs.

Internal Operating Temperature

Range (Notes 2, 14, 15)............................–40°C to 125°C

Storage Temperature Range .................. –55°C to 125°C

Peak Solder Reflow (Package Body) Temperature 245°C

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