8V97052 datasheet(43/48 Pages) RENESAS

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R31DS0022EU0110 Rev.1.1

Page 43

May 20, 2021

8V97052 Datasheet

The Rz, Cz and Cp can be calculated as 2nd order loop filter.

The following equation help determine the 3rd order loop filter Rp2 and Cp2.

Pick an Rp2 value. Rp2 ~ 1.5xRz is suggested.

Where,

 is ratio between the 1st pole frequency and the 2nd pole frequency. >4 is recommended.

8.4

Recommendations for Unused Input and Output Pins

8.4.1

Inputs

8.4.1.1

LVCMOS Control Pins

All control pins have internal pull-up and pull-down resistors; additional resistance is not required but can be

added for additional protection. A 1k

 resistor can be used.

8.4.2

Outputs

8.4.2.1

Output Pins

For any unused output, it can be left floating and disabled.

8.5

Case Temperature Considerations

This device supports applications in a natural convection environment which does not have any thermal

conductivity through ambient air. The Printed Circuit Board (PCB) is typically in a sealed enclosure without any

natural or forced air flow and is kept at or below a specific temperature. The device package design incorporates

an exposed pad (ePad) with enhanced thermal parameters which is soldered to the PCB where most of the heat

escapes from the bottom exposed pad. For this type of application, it is recommended to use the junction-to-board

thermal characterization parameter

JB (Psi-JB) to calculate the junction temperature (TJ) and ensure it does not

exceed the maximum allowed junction temperature in the Absolute Maximum Rating table.

The junction-to-board thermal characterization parameter,

JB, is calculated using the following equation:

TJ = TCB  JB  Pd, Where

▪ TJ = Junction temperature at steady state condition in (oC).

▪ TCB = Case temperature (Bottom) at steady state condition in (oC).

▪

JB = Thermal characterization parameter to report the difference between junction temperature and the

temperature of the board measured at the top surface of the board.

▪ Pd = power dissipation (W) in desired operating configuration.

The ePad provides a low thermal resistance path for heat transfer to the PCB and represents the key pathway to

transfer heat away from the IC to the PCB. It’s critical that the connection of the exposed pad to the PCB is

properly constructed to maintain the desired IC case temperature (TCB). A good connection ensures that

temperature at the exposed pad (TCB) and the board temperature (TB) are relatively the same. An improper

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