4

Maximum ratings

Symbol

Parameter

Value

Unit

FLAT-10

FLAT-16

Max. thermal resistance, junction-to-case

25

8

°C/W

Max. thermal resistance, junction-to-ambient

117

70

°C/W

0.70

1.10

W

0.21

0.36

W

1. Measured on 2s2p board as per std Jedec (JESD51-7) in natural convection.

Symbol

Parameter

Value

Unit

Supply voltage

PGND-0.3 to PGND+20

V

PGND

Power ground

-

V

SGND

Signal ground

PGND-5 to PGND+5

V

PWM_1

PWM_2

PWM input

SGND-0.3 to VCC+0.3

V

OUT_1

OUT_2

Driver output

PGND-0.3 to VCC+0.3

V

DC output current (for each driver)

750

mA

Storage temperature

-65 to 150

°C

Maximum operating junction temperature

150

°C

Lead temperature (soldering, 10 seconds) (1)

300

°C

ESD capability, human body model

2000

V

ESD capability, machine model

200

V

1. The distance is 1.5 mm far from the device body and the same lead is resoldered after 3 minutes.

RHRPM4424

Maximum ratings

DS11485 - Rev 7

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