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DSP56600FM/AD データシート(PDF) 63 Page - NXP Semiconductors |
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DSP56600FM/AD データシート(HTML) 63 Page - NXP Semiconductors |
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63 / 76 page  Preliminary MOTOROLA DSP56652 Technical Data Sheet 3-1 SECTION 3 PACKAGING PACKAGE INFORMATION This section provides information about the available packages for this product. The DSP56652 is available in a 196-pin plastic ball grid array (PBGA) package. The DSP56652 part (ROM-based DSP program memory) is delivered in a 15-mm (outline) PBGA. Compatibility between the footprints of the package is maintained to minimize impact to the customerÕs application board routing, such that the same board can be used for both the DSP56651 and DSP56652. 196 PBGA (GT), 15 x 15 mm, 1-mm Pitch Solder Balls The DSP56652 is offered in the JEDEC-standard, 15-mm PBGA with 1 mm pitch solder balls. Refer to Figure 3-1 on page 3-3 and Table 3-1 for package drawing and dimensions, respectively. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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