• The adhesive should have corrosion resistance, excellent insulation characteristics and no emission of toxic gasses nor any effect on the

human body.

• Do not use too much adhesive to avoid pollution of the soldering pads.

Soldering

• The solder profile must comply with the technical product specifications. All other profiles will void the warranty.

• All other soldering methods are at the customer’s own risk.

• Strong forces which may affect the coplanarity of the component’s electrical connection with the PCB (i.e. pins), can damage the part,

resulting in avoid of the warranty.

• Customer needs to ensure that the applied solder paste, the paste thickness and solder conditions are applicable to guarantee a

sufficient solder result according to the relevant criteria of IPC-A-610.

• Excessive amount of solder may lead to higher tensile force and chip cracking. Insufficient amount of solder may detach the capacitor

due to defective contacts.

• Do not use excessive nor insufficient flux.

• Provide enough washing when water-soluble flux is used.

• For reflow soldering, two times limitation is recommended.

• Wave soldering is recommended only for the following case sizes: 0603 and 0805, with maximal thickness of 0.85 mm.

Cleaning and Washing

• Washing agents used during the production to clean the customer’s application, might damage or change the characteristics of the wire

insulation body, the marking or the plating. Washing agent could have a negative effect on the long-term functionality of the product.

• Avoid Halogen in the flux or any contaminated flux as well as excessively high ultrasonic cleaning.

Coating, molding and potting of the PCB

• If the product is potted in the costumer’s application, the potting material might shrink or expand during and after hardening. Shrinking

could lead to an incomplete seal, allowing contaminants into the body and termination. Expansion could damage the body or

termination. We recommend a manual inspection after potting to avoid these effects.

• When coating and molding the PCB, verify the quality influence on the capacitor

• Verify the curing temperature and assure that there is no harmful decomposing or reaction gas emission during curing.

• Do not exceed the maximal temperature rise of 20°C.

Handling

• After soldering, please pay attention not to bend, twist or distort the PCB in handling and storage.

• Avoid excessive pressure during the functional check of the PCB.

• Avoid bending stress while breaking the PCB.

• After mounting, avoid piling up PCBs to avoid hitting the chip capacitor of another board.

These cautions and warnings comply with the state of the scientific and technical knowledge and are believed to be accurate and reliable.

However, no responsibility is assumed for inaccuracies or incompleteness.

Würth Elektronik eiSos GmbH & Co. KG

EMC & Inductive Solutions

Max-Eyth-Str. 1

74638 Waldenburg

Germany

Tel. +49 (0) 79 42 945 - 0

www.we-online.com

eiSos@we-online.com

CHECKED

REVISION

DATE (YYYY-MM-DD)

GENERAL TOLERANCE

PROJECTION

METHOD

AMM

001.000

2021-08-25

DIN ISO 2768-1m

DESCRIPTION

TECHNICAL REFERENCE

WCAP-CSRF High Frequency

MLCC

NP00402220J050DFCT1R000

ORDER CODE

885392005114

SIZE/TYPE

BUSINESS UNIT

STATUS

PAGE

0402

eiCap

Valid

7/8

This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH

& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety

must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.