LTM4650 datasheet(25/36 Pages) AD

25 / 36 page

LTM4650-2

Rev. 0

For more information www.analog.com

APPLICATIONS INFORMATION

Table 2. 0.9V Output

DERATING CURVE

VIN (V)

POWER LOSS CURVE

AIRFLOW (LFM)

HEAT SINK

θJA (°C/W)

Figure 15, Figure 16

5, 12

Figure 13

None

7.5

Figure 15, Figure 16

5, 12

Figure 13

200

None

5.5

Figure 15, Figure 16

5, 12

Figure 13

400

None

Figure 17, Figure 18

5, 12

Figure 13

BGA Heat Sink

Figure 17, Figure 18

5, 12

Figure 13

200

BGA Heat Sink

4.5

Figure 17, Figure 18

5, 12

Figure 13

400

BGA Heat Sink

Table 3. 1.5V Output

DERATING CURVE

VIN (V)

POWER LOSS CURVE

AIRFLOW (LFM)

HEAT SINK

θJA (°C/W)

Figure 19, Figure 20

5, 12

Figure 14

None

7.5

Figure 19, Figure 20

5, 12

Figure 14

200

None

5.5

Figure 19, Figure 20

5, 12

Figure 14

400

None

Figure 21, Figure 22

5, 12

Figure 14

BGA Heat Sink

Figure 21, Figure 22

5, 12

Figure 14

200

BGA Heat Sink

4.5

Figure 21, Figure 22

5, 12

Figure 14

400

BGA Heat Sink

HEAT SINK MANUFACTURER

PART NUMBER

WEBSITE

Wakefield

LTN20069-T5

wakefield-vette.com

the 120°C junction temperature, then the difference of

30°C divided by 5.5W equals a 5.4°C/W θJA thermal resis-

tance. Table 2 specifies a 5.5°C/W value, which is pretty

close. Table 2 and Table 3 provide equivalent thermal

resistances for 0.9V and 1.5V outputs with and without

airflow and heat sinking.

The derived thermal resistances in Table 2 and Table 3

for the various conditions can be multiplied by the calcu-

lated power loss as a function of ambient temperature to

derive temperature rise above ambient, thus maximum

junction temperature. Room temperature power loss

can be derived from the efficiency curves and adjusted

with the above ambient temperature multiplicative fac-

tors. The printed circuit board is a 1.6mm thick 4-layer

board with 2oz copper on each layer. The PCB dimen-

sions are 101mm × 114mm. The BGA heat sinks are listed

in Table 3.

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