ST10F271B datasheet(129/180 Pages) STMICROELECTRONICS

129 / 180 page

ST10F271B/ST10F271E

Electrical characteristics

129/180

Based on thermal characteristics of the package and with reference to the power

consumption figures provided in next tables and diagrams, the following product

classification can be proposed. Anyhow, the exact power consumption of the device inside

the application must be computed according to different working conditions, thermal profiles,

real thermal resistance of the system (including printed circuit board or other substrata), I/O

activity, and so on.

24.4

Parameter interpretation

The parameters listed in the following tables represent the characteristics of the ST10F271

and its demands on the system.

Where the ST10F271 logic provides signals with their respective timing characteristics, the

symbol “CC” for Controller Characteristics, is included in the “Symbol” column. Where the

external system must provide signals with their respective timing characteristics to the

ST10F271, the symbol “SR” for System Requirement, is included in the “Symbol” column.

Table 61.

Thermal characteristics

Symbol

Description

Value (typical)

Unit

ΘJA

Thermal Resistance Junction-Ambient

PQFP 144 - 28 x 28 x 3.4 mm / 0.65 mm pitch

TQFP 144 - 20 x 20 mm / 0.5 mm pitch

TQFP 144 - 20 x 20 mm / 0.5 mm pitch on four layer

FR4 board (2 layers signals / 2 layers power)

°C/W

Table 62.

Package characteristics

Package

Ambient temperature range

CPU frequency range

PQFP 144

–40 / +125°C1 – 64MHz

TQFP 144

–40 / +125°C1 – 40MHz

–40 / +105°C1 – 48MHz

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