STA2416 datasheet(36/38 Pages) STMICROELECTRONICS

36 / 38 page

Package information

STA2416

36/38

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 16.

LFBGA120 (10x10x1.4mm) mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

1.40

0.055

0.20

0.008

0.039

0.25

0.30

0.35

0.010

0.012

0.014

9.90

10.00

10.10

0.390

0.394

0.398

8.50

0.335

6.50

0.256

9.90

10.00

10.10

0.390

0.394

0.398

8.50

0.335

6.50

0.256

0.50 basic

0.020 basic

0.50 basic

0.020 basic

0.75

0.029

0.75

0.029

120 balls

0.25 basic

0.0098 basic

0.25 basic

0.0098 basic

Tolerance

aaa

0.15

0.006

bbb

0.10

0.0039

ddd

0.08

0.0031

eee

0.15

0.006

fff

0.05

0.002

LFBGA120

Low Fine Ball Grid Array

Body: 10 x 10 x 1.4mm

7513355 A

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