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X24C01

LIMITED WARRANTY

Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty, express,

statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Xicor, Inc. makes no

warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and prices at any time and without

notice.

Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, licenses are implied.

U.S. PATENTS

Xicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265; 4,326,134; 4,393,481; 4,404,475; 4,450,402;

4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829, 482; 4,874, 967; 4,883, 976. Foreign patents and additional patents

pending.

LIFE RELATED POLICY

In situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error detection

and correction, redundancy and back-up features to prevent such an occurrence.

Xicor's products are not authorized for use in critical components in life support devices or systems.

1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose

failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the

user.

2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support

device or system, or to affect its safety or effectiveness.

Device

ORDERING INFORMATION

Blank = 4.5V to 5.5V

3.5 = 3.5V to 5.5V

3 = 3.0V to 5.5V

2.7 = 2.7V to 5.5V

Temperature Range

Blank = Commercial = 0°C to +70°C

I = Industrial = –40°C to +85°C

M = Military = –55°C to +125°C

Package

P = 8-Lead Plastic DIP

S = 8-Lead SOIC

M = 8-Lead MSOP

X24C01

P

T

G -V

X24C01

X G

X

Blank = 8-Lead SOIC

P = 8-Lead Plastic DIP

M = 8-Lead MSOP

G = RoHS compliant lead free

Blank = 4.5V to 5.5V, 0°C to +70°C

F = 2.7V to 5.5V, 0°C to +70°C

G = 2.7V to 5.5V, –40°C to +85°C

I = 4.5V to 5.5V, –40°C to +85°C

B = 3.5V to 5.5V, 0°C to +70°C

C = 3.5V to 5.5V, –40°C to +85°C

D = 3.0V to 5.5V, 0°C to +70°C

E = 3.0V to 5.5V, –40°C to +85°C

M = 4.5V to 5.5V, –55°C to +125°C

Part Mark Convention

G=RoHS Compliant Lead Free package

Blank = Standard package. Non lead free