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LP5900

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SNVS358R – JULY 2005 – REVISED JUNE 2016

Product Folder Links: LP5900

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Copyright © 2005–2016, Texas Instruments Incorporated

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation see the following:

AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009)

AN-1112 AN-1112 Leadless Leadframe Package (LLP) (SNOA401)

IC Package Thermal Metrics application report (SPRA953)

11.2 Trademarks

All trademarks are the property of their respective owners.

11.3 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

11.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.