M7010R datasheet(65/67 Pages) STMICROELECTRONICS

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M7010R

PACKAGE MECHANICAL INFORMATION

Figure 46. PBGA-Z00 – 272-ball Plastic Ball Grid Array Package Outline

Note: Drawing is not to scale.

Table 41. PBGA-Z00 – 272-ball Plastic Ball Grid Array Package Mechanical Data

Note: 1. Maximum mounted height is 2.45mm based on a 0.65mm ball pad diameter. Solder paste is 0.15mm thickness and 0.65mm in di-

ameter.

2. The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink, or metallized markings, or other feature

of package body or integral heatslug.

3. A distinguished feature is allowable on the bottom surface of the package to identify the terminal A1 corner.

4. Exact shape of each corner is optional.

Symb

inches

Typ

Min

Max

Typ

Min

Max

A(4)

27.00

26.80

27.20(1)

1.102

1.094

1.110(1)

A1(2,3)

0.60

0.50

0.70

0.024

0.020

0.029

1.63

1.90

0.067

0.078

B(4)

27.00

26.80

27.20

1.102

1.094

1.110

0.75

0.60

0.90

0.031

0.024

0.037

27.00

26.80

27.20

1.102

1.094

1.110

24.13

0.985

24.00

0.980

27.00

26.80

27.20

1.102

1.094

1.110

24.13

0.985

24.00

0.980

1.27

0.052

ddd

0.20

0.008

1.17 REF.

0.56 REF.

PIN #1

ddd C

0.220 (3x)

0.300 C

0.100 C

B S

PBGA-Z00

4.00*45˚ (4x)

30˚ TYP.

b (272x)

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