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MPC5634M データシート(PDF) 60 Page - Freescale Semiconductor, Inc |
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MPC5634M データシート(HTML) 60 Page - Freescale Semiconductor, Inc |
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60 / 118 page  MPC5634M Microcontroller Data Sheet, Rev. 4 Preliminary—Subject to Change Without Notice Electrical characteristics Freescale Semiconductor 60 3.3 Thermal characteristics Table 9. Thermal characteristics for 144-pin LQFP1 1 Thermal characteristics are targets based on simulation that are subject to change per device characterization. Symbol C Parameter Conditions Value Unit RθJA CC D Junction-to-Ambient, Natural Convection2 2 Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board meets JEDEC specification for this package. Single layer board - 1s 43 °C/W RθJA CC D Junction-to-Ambient, Natural Convection2 Four layer board - 2s2p 35 °C/W RθJMA CC D Junction-to-Ambient2 Single layer board 34 °C/W RθJMA CC D Junction-to-Ambient2 Four layer board 2s2p 29 °C/W RθJB CC D Junction-to-Board3 3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification for the specified package. 22 °C/W RθJCtop CC D Junction-to-Case4 4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer. 8 °C/W Ψ JT CC D Junction-to-Package Top, Natural Convection5 5 Thermal characterization parameter indicating the temperature difference between the package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT. 2 °C/W Table 10. Thermal characteristics for 176-pin LQFP1 1 Thermal characteristics are targets based on simulation that are subject to change per device characterization. Symbol C Parameter Conditions Value Unit RθJA CC D Junction-to-Ambient, Natural Convection2 2 Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board meets JEDEC specification for this package. Single layer board - 1s 43 °C/W RθJA CC D Junction-to-Ambient, Natural Convection2 Four layer board - 2s2p 36 °C/W RθJMA CC D Junction-to-Ambient2 Single layer board - 1s 35 °C/W RθJMA CC D Junction-to-Ambient2 Four layer board - 2s2p 30 °C/W RθJB CC D Junction-to-Board3 3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification for the specified package. 25 °C/W RθJCtop CC D Junction-to-Case4 4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer. 9 °C/W Ψ JT CC D Junction-to-Package Top, Natural Convection5 5 Thermal characterization parameter indicating the temperature difference between the package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT. 2 °C/W |
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